Wipro Placement Paper
Company: Wipro Infotech
Section1-English : 15 questions
Section2-aptitude : 15 questions
Section3-technical : 20 questions
There was individual cut off for all the sections.
Contents
English :
* There were a few questions of filling the blanks
* There were a few analogy type questions which were easy.
* There were no comprehension or antonyms & synonyms.
Aptitude :
* This paper was quite tough and the questions were lengthy .
* The printing of the paper was clumsy too.
1. All the questions were so big that I remember the conditions of none of the questions properly.
2. All the questions had some 6 to 7 conditions given .
3. By applying those conditions it was required to find the solution.
4. None of the questions were too easy.
5. Practice hard to gain fluency.
Technical :
Some of the questions were:
* Convert 181 to binary code.
* What is rom?
* Questions about stack,queue,tree
* Some questions about microprocessors.
* Questions about internet protocol,networking.
* A nand gate is equivalent to a negative or gate.
INTERVIEW.
* The tech interview for it & allied students would be really tough.
* If u have any project prepare thoroughly for that.
* The panel is genuinely a tough nut to crack.
* For non it students a good knowledge of C language should be sufficient.
Hr interview was a formality
Wipro Placement Paper
About Wipro
Wipro Limited (NYSE: WIT, BSE: 507685, NSE: WIPRO) is a leading global information technology, consulting and business process services company. We harness the power of cognitive computing, hyper-automation, robotics, cloud, analytics and emerging technologies to help our clients adapt to the digital world and make them successful. A company recognized globally for its comprehensive portfolio of services, strong commitment to sustainability and good corporate citizenship, we have over 190,000 dedicated employees serving clients across six continents. Together, we discover ideas and connect the dots to build a better and a bold new future. visit offical Website of Wipro for more details